Students in the School of Technology participated in the Student Design Contest held at PACK Expo in Chicago on November 2nd. The contest challenged packaging students to use Packexpo.com and PACK EXPO International to find a conveying-related packaging line solution.
The team from Purdue University Calumet was awarded 2nd Place. The team consisted of Jen Vacendak, Chris Salas, Abdulhaleem Al-owaisheer, Daniel Seim, and Prof. Jim Higley, faculty advisor. The students will share a scholarship of $2,000.
The Team put on a solid performance in front of industry leaders and was rewarded for their efforts. Their solution took into account environmental impact, energy consumption, ease of use, and cost considerations. All team members felt the knowledge learned and the experience of seeing their future careers in front of them was very rewarding.
Students from 9 schools competed, and in the eyes of PMMI Vice President of Education and Workforce Development Maria Ferrante, the true ‘grand prize’ was the experience each student gained.
“The PACK EXPO Student Design Competition takes learning beyond the classroom by giving students the opportunity to solve real world problems in a business environment,” says Ferrante.
The teams researched their projects at Packexpo.com and on site in Chicago, and presented them to a panel of judges from the packaging industry.
The PMMI Education & Training Foundation provided the scholarship funds.