Scholarships/Stipends Available

PATRICK SHARKEY MEMORIAL SCHOLARSHIP
CLAUDE S. BREEDEN SCHOLARSHIP

Application for 2013 Scholarships [Opens in New Window]
Complete and Return by September 15, 2013

Scholarship Criteria:

  • Student must be a Mechatronics Engineering Technology major in the School of Technology.
  • Student must have a minimum cum 2.9 GPA to apply.  Beginning freshman must have a minimum of 3.00 to apply.
  • Student must write an essay discussing their interest in the Packaging Industry and their future career plans.
  • Selection of recipients will be made by the Department of Engineering Technology.

 

RICHARD C. RYAN PACKAGING EDUCATION SCHOLARSHIP

Application for 2013 Scholarships [Opens in New Window]
Complete and Return by May 31, 2013

This Scholarship is established by Dorner Mfg. Corp. and administered by the PMMI Education & Training Foundation. This scholarship will be awarded to a student enrolled in a two or four-year program at any of PMMI’s Partner schools.

Scholarship Criteria:

  • Have a GPA of 3.0 or higher
  • Be majoring in packaging engineering or a related area
  • Demonstrate a commitment to excellence in the packaging industry
  • Be currently enrolled and attending a PMMI Partner School
  • Demonstrate extra-curricular involvement, such as athletics
  • Have a recommendation from faculty

Students wishing to apply for this scholarship should write a 500-1,000 word essay describing their interest in the packaging field and their career goals, and submit it with their application.Any students planning to enroll in the 2014 fall semester are encouraged to apply.